| Electronic Components Datasheet Search |
|
MP4568 Datasheet(PDF) 14 Page - Monolithic Power Systems |
|
|
|||||||||||||||||||||||||||||
MP4568 Datasheet(HTML) 14 Page - Monolithic Power Systems |
|
14 / 16 page ![]() MP4568 ―60V, 100mA, SYNCHRONOUS STEP-DOWN CONVERTER MP4568 Rev. 1.01 www.MonolithicPower.com 14 8/18/2013 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2013 MPS. All Rights Reserved. Soft Start Capacitor There is an internal 1ms soft start when float SS pin and this is the shortest soft start time. To get longer soft start, it needs to add capacitor between SS pin and GND. The soft start time is the duration when SS is charged from 0 to FB reference voltage 1V by an internal 3 μA current source. So the capacitor at SS pin can be chosen according to below formula: SS SS C3 Τ ( F) To get the soft start time longer than 1ms, a capacitor bigger than 3nF is needed. When using a capacitor smaller than 3nF, the soft start time is the internal 1ms soft start. Feedforward Capacitor As described above that the PWM control scheme of MP4568 is very special and the HS turn on when FB drops lower than reference voltage. This brings good load transient performance. However, this also makes the HS turn on moment is very sensitive to the FB voltage. Once there is noise on FB, the moment HS turns on is easy to be affected, and then Fsw jitter would occur. The Fsw jitter is easy to happen especially when Vo ripple is very small. To improve the jitter performance, a small feedforward capacitor between Vo and FB can be used and typical 39pF is recommended. PCB Layout 1) Keep the path of switching current short and minimize the loop area formed by input capacitor, high-side, low-side MOSFET and output capacitor. 2) Bypass ceramic capacitors should be as close as possible to the VIN pin. 3) Make sure that all feedback connections are short and direct. Place the feedback resistors as close to the chip as possible. 4) Keep SW away from sensitive analog areas such as FB. 5) For better thermal performance and long-term reliability consideration, VIN, SW and GND should be connected to a large copper area respectively to cool the chip. C2 R3 GND OUT IN R1 R2 C3 C1 R1 Figure 7 – PCB Layout Example Design Example Below is a design example following the application guidelines for the specifications: Table 2 — Design Example VIN 4.5V – 45V VOUT 3.3V Io 100mA The detailed application schematic is shown in Figure 8. The typical performance and circuit waveforms have been shown in the Typical Performance Characteristics section. For more device applications, please refer to the related Evaluation Board Datasheets. VIN EN C1 SW 2 EN 9 ENHY 8 ILIM 6 IN 10 FB 5 BIAS 4 MP4568 SS 7 U1 R3 C2 L1 C3 VOUT 3.3V/100mA 2M 10uF 22uF 100uH 0.1uF R1 523k R2 1.2M R4 100k C4 10nF C5 39pF Figure 8 — Detailed Application Schematic |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |