MP20051DN datasheet(2/12 Pages) MPS

2 / 12 page

MP20051 – LOW NOISE HIGH PSRR 1A LINEAR REGULATOR

MP20051 Rev.1.11

www.MonolithicPower.com

12/26/2013

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Package

Top Marking

Free Air Temperature (TA)

MP20051DQ*

QFN8 (3 x 3mm)

ABR

MP20051DN**

SOIC8E

MP20051

-40°C to +85°C

* For Tape & Reel, add suffix –Z (e.g. MP20051DQ–Z);

For RoHS Compliant Packaging, add suffix –LF (e.g. MP20051DQ–LF–Z)

** For Tape & Reel, add suffix –Z (e.g. MP20051DN–Z);

For RoHS Compliant Packaging, add suffix –LF (e.g. MP20051DN–LF–Z)

PACKAGE REFERENCE

TOP VIEW

OUT

GND

EXPOSED PAD

ON BACKSIDE

CONNECT TO GND

OUT

GND

TOP VIEW

EXPOSED PAD

ON BACKSIDE

CONNECT TO GND

QFN8 (3 x 3mm)

SOIC8E

ABSOLUTE MAXIMUM RATINGS

(1)

VIN, EN, FB to GND .......................-0.3V to +6V

OUT to GND ...................... -0.5V to (VIN + 0.5V)

Continuous Power Dissipation ......(TA=25°C)

(2)

QFN8 (3x3mm)................................................2.0W

SOIC8E ............................................................2.0W

Junction Temperature...............................150

°C

Storage Temperature Range ..... -65°C to 150°C

Lead Temperature (Soldering, 10sec)...........260°C

ESD SUSCEPTIBILITY

(3)

HBM (Human Body Mode).......................... 2kV

MM (Machine Mode) ................................. 200V

Recommended Operating Conditions

(4)

Supply Input Voltage.......................2.5V to 5.5V

Enable Input Voltage .........................0V to 5.5V

Operating Junction Temp. (TJ). -40°C to +125°C

Thermal Resistance

(5)

θJA

θJC

QFN8 (3x3mm) .......................50 ...... 12 ... °C/W

SOIC8E...................................50 ...... 10 ... °C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) Devices

are

ESD

sensitive.

Handling

precaution

recommended.

4) The device is not guaranteed to function outside of its

operating conditions.

5) Measured on JESD51-7, 4-layer PCB.

MP20051DN Datasheet(PDF) 2 Page - Monolithic Power Systems

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