www.austriamicrosystems.com/DC-DC_Step-Up/AS1323

Revision 1.07

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AS1323

Datasheet - Pack a ge Drawin gs and Ma r k ings

10 Package Drawings and Markings

The device is available in an TSOT23-5 package.

Figure 22. TSOT23-5 Package

Notes:

1. Dimensions are in millimeters.

2. Dimension D does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, and gate burrs shall not exceed

0.15mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.15mm

per side. Dimensions D and E1 are determined at datum H.

3. The package top can be smaller than the package bottom. Dimensions D and E1 are determined at the outermost extremes of the

plastic body exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but include any mismatches between the top of the

package body and the bottom. D and E1 are determined at datum H.

Symbol

Min

Typ

Max

Notes

Symbol

Min

Typ

Max

Notes

A

1.00

L

0.30

0.40

0.50

A1

0.01

0.05

0.10

L1

0.60REF

A2

0.84

0.87

0.90

L2

0.25BSC

b

0.30

0.45

N

5

b1

0.31

0.35

0.39

R

0.10

c

0.12

0.15

0.20

R1

0.10

0.25

c1

0.08

0.13

0.16

θ

0º

4º

8º

D

2.90BSC

3,4

4º

10º

12º

E

2.80BSC

3,4

Tolerances of Form and Position

E1

1.60BSC

3,4

aaa

0.15

e

0.95BSC

bbb

0.25

e1

1.90BSC

ccc

0.10

ddd

0.20