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PIC16F84A Datasheet(PDF) 127 Page - Microchip Technology |
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PIC16F84A Datasheet(HTML) 127 Page - Microchip Technology |
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127 / 337 page ![]() © 1997 Microchip Technology Inc. DS30234D-page 127 PIC16C6X 13.2.3 EXTERNAL CRYSTAL OSCILLATOR CIRCUIT Either a prepackaged oscillator can be used or a simple oscillator circuit with TTL gates can be built. Prepack- aged oscillators provide a wide operating range and better stability. A well-designed crystal oscillator will provide good performance with TTL gates. Two types of crystal oscillator circuits can be used; one with series resonance, or one with parallel resonance. Figure 13-6 shows implementation of a parallel reso- nant oscillator circuit. The circuit is designed to use the fundamental frequency of the crystal. The 74AS04 inverter performs the 180-degree phase shift that a par- allel oscillator requires. The 4.7 k Ω resistor provides the negative feedback for stability. The 10 k Ω potenti- ometer biases the 74AS04 in the linear region. This could be used for external oscillator designs. FIGURE 13-6: EXTERNAL PARALLEL RESONANT CRYSTAL OSCILLATOR CIRCUIT Figure 13-7 shows a series resonant oscillator circuit. This circuit is also designed to use the fundamental fre- quency of the crystal. The inverter performs a 180- degree phase shift in a series resonant oscillator cir- cuit. The 330 k Ω resistors provide the negative feed- back to bias the inverters in their linear region. FIGURE 13-7: EXTERNAL SERIES RESONANT CRYSTAL OSCILLATOR CIRCUIT 20 pF +5V 20 pF 10k 4.7k 10k 74AS04 XTAL 10k 74AS04 PIC16CXX CLKIN To Other Devices 330 k Ω 74AS04 74AS04 PIC16CXX CLKIN To Other Devices XTAL 330 k Ω 74AS04 0.1 µF 13.2.4 RC OSCILLATOR For timing insensitive applications the RC device option offers additional cost savings. The RC oscillator fre- quency is a function of the supply voltage, the resistor (Rext) and capacitor (Cext) values, and the operating temperature. In addition to this, the oscillator frequency will vary from unit to unit due to normal process param- eter variation. Furthermore, the difference in lead frame capacitance between package types will also affect the oscillation frequency, especially for low Cext values. The user also needs to take into account variation due to tolerance of external R and C components used. Figure 13-8 shows how the RC combination is con- nected to the PIC16CXX. For Rext values below 2.2 k Ω, the oscillator operation may become unstable or stop completely. For very high Rext values (e.g. 1 M Ω), the oscillator becomes sensitive to noise, humidity and leakage. Thus, we recommend keeping Rext between 3 k Ω and 100 kΩ. Although the oscillator will operate with no external capacitor (Cext = 0 pF), we recommend using values above 20 pF for noise and stability reasons. With no or small external capacitance, the oscillation frequency can vary dramatically due to changes in external capacitances, such as PCB trace capacitance or pack- age lead frame capacitance. See characterization data for desired device for RC fre- quency variation from part to part due to normal pro- cess variation. The variation is larger for larger R (since leakage current variation will affect RC frequency more for large R) and for smaller C (since variation of input capacitance will affect RC frequency more). See characterization data for desired device for varia- tion of oscillator frequency due to VDD for given Rext/ Cext values as well as frequency variation due to oper- ating temperature for given R, C, and VDD values. The oscillator frequency, divided by 4, is available on the OSC2/CLKOUT pin, and can be used for test pur- poses or to synchronize other logic (see Figure 3-5 for waveform). FIGURE 13-8: RC OSCILLATOR MODE OSC2/CLKOUT Cext VDD Rext VSS PIC16CXX OSC1 Fosc/4 Internal clock |
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