TSL1402R datasheet(15/17 Pages) AMSCO

15 / 17 page

TSL1402R

256 × 1 LINEAR SENSOR ARRAY WITH HOLD

TAOS041G − NOVEMBER 2011

E 2011, TAOS Inc.

The LUMENOLOGY

r Company

www.taosinc.com

SOLDERING INFORMATION

TSL1402 256

y 1 linear array 14-lead gold pin package soldering instructions:

D The TSL1402R has been designed to withstand a lead temperature during soldering of 260°C for

10 seconds at a distance of 1.6 mm from the package body.

D In most applications, these through-hole parts will be sufficiently protected by the combination of the PCB

or flex plus the standoff provided by the package.

D If lead clipping is required, this should be performed after solder attach to prevent the pulling of the lead from

the package body.

D As in all board manufacturing, care should be taken to prevent part bending during board singulation or final

assembly.

D If the process includes both surface-mount parts and the TSL1402R, the surface mount operations should

be completed first with the through-hole parts afterward.

These parts can be washed as a part of the flux cleanup operation. A final top-surface cleanup may be required

with water or alcohol to remove any remaining particles.

TSL1402R Datasheet(PDF) 15 Page - ams AG