Datasheet

www.rohm.com

TSZ02201-0RAR1G200090-1-2

© 2012 ROHM Co., Ltd. All rights reserved.

21/26

31.OCT.2012 Rev.001

TSZ22111･15･00

BA2107G, BA2115xxx

(b) Derating curve

●Power Dissipation

Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature). IC is heated

when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that

can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.

Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal

resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum

value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead

frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called

thermal resistance, represented by the symbol θja℃/W.The temperature of IC inside the package can be estimated by this

thermal resistance. Figure 52. (a) shows the model of thermal r

esistance of the package. Thermal resistance θja, ambient

temperature Ta, maximum

junction temperature Tjmax, and power dissipation Pd can be calculated by the equation

below:

θja = (Tjmax-Ta) / Pd

℃/W

・・・・・

(Ⅰ)

Derating curve in Figure 52. (b) indicates power that can be consumed by IC with reference to ambient temperature. Power

that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate

at certain ambient temperature. This gr

adient is determined by thermal resistance θja. Thermal resistance θja depends on

chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of

package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 53. (c),(d)

show a derating curve for an example of BA2107,BA2115.

(*10)

(*11)

(*12)

Unit

5.4

6.2

4.8

mW/℃

When using the unit above Ta=25℃, subtract the value above per degree℃. Permissible dissipation is the value.

Permissible dissipation is the value when FR4 glass epoxy board 70mm ×70mm ×1.6mm (cooper foil area below 3%) is mounted.

0

200

400

600

800

1000

0

25

50

75

100

125

AMBIENT TEMPERATURE [℃]

0

200

400

600

800

1000

0

25

50

75

100

125

AMBIENT TEMPERATURE [℃]

Figure 53. Derating curve

(a) Thermal resistance

Figure 52. Thermal resistance and derating curve

(c)BA2107

(d)BA2115

0

50

75

100

125

150

25

P1

P2

Pd (max)

LSIの消費電力 [W]

θ' ja2

θ' ja1

Tj ' (max)

θja2 < θja1

周囲温度 Ta [℃ ]

θ ja2

θ ja1

Tj (max)

Power dissipation of LSI [W]

Ambient temperature Ta [℃]

BA2115FVM

BA2115F

BA2107G

780mW(

675mW(

590mW(

周囲温度 Ta [℃]

チップ 表面温度 Tj [℃]

消費電力 P [W]

Ambient temperature Ta [℃]

Chip surface temperature Tj [℃]

Power dissipation P [W]

θja=(Tjmax-Ta)/Pd ℃/W

BA2115FJ

675mW(