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LM7372IMA Datasheet(PDF) 18 Page - National Semiconductor (TI) |
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LM7372IMA Datasheet(HTML) 18 Page - National Semiconductor (TI) |
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18 / 26 page ![]() + - + VIN 2k 1:1 2k Twisted Pair Line 2k 100 1/2 LM7372 + - 50 50 20uF 0.1uF + 1/2 LM7372 V- V+ 0.1uF 5.1k 5.1k 1 3 2 8 7 6 5 4 0.1uF - VIN 20uF 0.1uF + LM7372 SNOS926E – MAY 1999 – REVISED MARCH 2013 www.ti.com Figure 28. Split Supply Application (SO PowerPAD) PRINTED CIRCUIT BOARD LAYOUT and EVALUATION BOARDS Generally, a good high-frequency layout will keep power supply and ground traces away from the inverting input and output pins. Parasitic capacitance on these nodes to ground will cause frequency response peaking and possible circuit oscillations (see Application Note OA-15 (SNOA367) for more information). Texas Instruments suggests the following evaluation boards as a guide for high frequency layout and as an aid in device testing and characterization: Device Package Evaluation Board PN LM7372MA 16-Pin SOIC None LM7372MR 8-Pin SO PowerPAD CLC730121 The DAP (die attach paddle) on the 8-Pin SO PowerPAD should be tied to V−. It should not be tied to ground. See the respective Evaluation Board documentation. 18 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM7372 |
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