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DS9034PCX Datasheet(PDF) 13 Page - Dallas Semiconductor |
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DS9034PCX Datasheet(HTML) 13 Page - Dallas Semiconductor |
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13 / 17 page ![]() DS1743/DS1743P 13 of 17 AC TEST CONDITIONS Output Load: 100 pF + 1TTL Gate Input Pulse Levels: 0.0 to 3.0V Timing Measurement Reference Levels: Input: 1.5V Output: 1.5V Input Pulse Rise and Fall Times: 5 ns NOTES: 1. Voltages are referenced to ground. 2. Typical values are at 25 °C and nominal supplies. 3. Outputs are open. 4. Battery switchover occurs at the lower of either the battery terminal voltage or VPF. 5. The CE2 control signal functions exactly the same as the CE signal except that the logic levels for active and inactive levels are opposite. 6. Data retention time is at 25 °C. 7. Each DS1743 has a built-in switch that disconnects the lithium source until VCC is first applied by the user. The expected t DR is defined for DIP modules as a cumulative time in the absence of VCC starting from the time power is first applied by the user. 8. Real-Time Clock Modules (DIP) can be successfully processed through conventional wave-soldering techniques as long as temperatures as long as temperature exposure to the lithium energy source contained within does not exceed +85 °C. Post-solder cleaning with water washing techniques is acceptable, provided that ultrasonic vibration is not used. In addition, for the PowerCap: a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through solder reflow oriented with the label side up (“live - bug”). b. Hand Soldering and touch-up: Do not touch or apply the soldering iron to leads for more than 3 (three) seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove the part, apply flux, heat the lead frame pad until the solder reflow and use a solder wick to remove solder. |
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