CYStech Electronics Corp.

Spec. No. : C545PC

Issued Date : 2010.12.20

Revised Date :

Page No. : 6/6

LM339PC

CYStek Product Specification

DIP-14L Dimension

DIP-14L Plastic Package

CYStek Package Code : PC

Marking:

Device

Name

LM339

□□□□

Date

Code

Millimeters

Inches

Millimeters

Inches

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

-

5.334

-

0.210

D

18.920

19.690

0.745

0.775

A1

0.381

-

0.015

-

E

6.096

6.604

0.240

0.260

A2

3.175

3.429

0.125

0.135

E1

7.493

8.001

0.295

0.315

b

0.406

0.508

0.016

0.020

e

2.413

2.667

0.095

0.105

b1

0.356

0.508

0.014

0.020

8.509

9.525

0.335

0.375

b2

1.270

1.778

0.050

0.070

L

3.175

3.683

0.125

0.145

0°

15°

0°

15°

c

0.203

0.356

0.008

0.014

S

c1

0.203

0.279

0.008

0.011

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material :

• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.