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SSM3055L Datasheet(PDF) 2 Page - SeCoS Halbleitertechnologie GmbH |
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SSM3055L Datasheet(HTML) 2 Page - SeCoS Halbleitertechnologie GmbH |
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2 / 4 page ![]() http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually. Elektronische Bauelemente SSM3055L 2.8A , 60V , RDS(ON) 100 mΩ Ω Ω Ω N-Channel Enhancement Mode MOSFET 26-Jul-2013 Rev. A Page 2 of 4 ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise specified) Parameter Symbol Min. Typ. Max. Unit Teat Conditions Static Drain-Source Breakdown Voltage BVDSS 60 - - V VGS=0, ID=250µA Gate-Threshold Voltage VGS(th) 1 - 2.5 V VDS=VGS, ID=250µA Gate-Body Leakage Current IGSS - - ±100 nA VGS=±20V TJ=25°C - - 1 V DS=48V, VGS=0 Drain-Source Leakage Current TJ=55°C IDSS - - 5 µA VDS=48V, VGS=0 - - 100 VGS=10V, ID=2.5A Drain-Source On-Resistance 2 RDS(ON) - - 110 m VGS=4.5V, ID=2A Total Gate Charge Qg - 5 - Gate-Source Charge Qgs - 1.68 - Gate-Drain (‘’Miller’’)Charge Qgd - 1.9 - nC VDS=48V, VGS=4.5V, ID=2A Turn-on Delay Time 2 Td(on) - 1.6 - Rise Time Tr - 7.2 - Turn-off Delay Time Td(off) - 25 - Fall Time Tf - 14.4 - nS VDD=30V, VGS=10V, RG=3.3 , ID=2A Input Capacitance Ciss - 511 - Output Capacitance Coss - 38 - Reverse Transfer Capacitance Crss - 25 - pF VGS=0, VDS=15V, f=1.0MHz Source-Drain Diode Diode Forward Voltage 2 VSD - - 1.2 V IS=1A, VGS=0 Continuous Source Current 1.4 IS - - 2.8 Pulsed Source Current 2.4 ISM - - 12 A VG=VD=0, Force Current Reverse Recovery Time TRR - 9.7 - nS Reverse Recovery Charge QRR - 5.8 - nC IS=2A, dI/dt=100A/µs VGS=0 Notes: 1. Surface mounted on a 1 inch2 FR4 board with 2OZ copper, t≦10sec., 125°C /W when mounted on Min. copper pad. 2. The data tested by pulsed , pulse width≦300µs, duty cycle≦2% 3. The power dissipation is limited by 150 °C junc tion temperature 4. The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation |
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