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SIM3U167 Datasheet(PDF) 17 Page - Silicon Laboratories |
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SIM3U167 Datasheet(HTML) 17 Page - Silicon Laboratories |
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17 / 18 page ![]() Rev. 1.1 17 DOCUMENT CHANGE LIST Revision 0.1 to Revision 0.2 Updated Table 3 on page 11. Corrected pin name for physical pad number 62. Corrected title of Figure 1 on page 10. Revision 0.2 to Revision 1.0 Updated front page with block diagram, to match standard device data sheet. Updated Table 2 on page 3. Changed “RTC0OSC_OUT” pin function to “RTC0TCLK_OUT”. Revision 1.0 to Revision 1.1 Added "1. Ordering Information" on page 2. Added "2. Pin Definitions" on page 3. Added "3. Bonding Instructions" on page 10. Updated Table 4, “Wafer and Die Information,” on page 15. Added “backgrind” and “no backgrind” specs. Added "4. Wafer Specific Information" on page 16. Added "6. Failure Analysis (FA) Guidelines" on page 16. |
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