LM3555TLE datasheet(3/33 Pages) TI

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LM3555

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SNVS594E – JANUARY 2009 – REVISED NOVEMBER 2011

Pin Descriptions (continued)

VIN

Input voltage pin of the device. Connect input bypass capacitor very close

to this pin.

Inductor connection.

TORCH

Torch pin. Driving this pin high enables Torch mode.

IND

Red indicator LED current source. Connect to RED LED anode.

VOUT

Boost output. Connect output bypass capacitor very close to this pin.

STROBE

I/O

Strobe signal input pin to synchronize flash pulse in I2C mode. This signal

usually comes from the camera processor. In Simple logic mode this pin,

when tied to a voltage rail through a pull-up resistor indicates the number

of LEDs in the system.

I2C / EN

I2C / EN-logic selection. High = I2C mode, Low = Simple logic mode.

VLED

LED current source. Connect to the anode of the Flash LED. One or two

LEDs can be connected in series.

SDA / EN2

I/O

EN2 signal pin in Simple logic mode. I2C data signal in I2C mode.

SCL / EN1

EN1 signal pin in Simple logic mode. I2C clock signal in I2C mode.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

VIN

-0.3V to +6V

TORCH, IND, STROBE, I2C/EN, SDA/EN2, SCL/EN1

-0.3V to (VIN+0.3V) w/ 6.0V max.

+12V

VOUT, VLED

+10V

Continuous Power Dissipation (3)

Internally Limited

Junction Temperature (TJ-MAX) )

+150°C

Storage Temperature Range

-55°C to +150°C

Maximum Lead Temperature (Soldering)

(4)

ESD Rating

Human Body Model(5)

2.5kV

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under

which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed

performance limits and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150°C (typ.) and

disengages at TJ=135°C (typ.). Thermal shutdown is guaranteed by design.

(4)

For detailed soldering specifications and information, please refer to Texas Instruments Application Note: AN-1112: Micro SMD Wafer

Level Chip Scale Package. For Recommended Soldering Profiles.

(5)

The human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. (MIL-STD-883 3015.7)

Operating Ratings

(1) (2)

Input Voltage Range

2.5 to 5.5V

Junction Temperature Range (TJ)

−30°C to +125°C

Ambient Temperature Range (TA)

(3)

−30°C to +85°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under

which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed

performance limits and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be de-rated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

+125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

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