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RC2012 Datasheet(PDF) 14 Page - Samsung semiconductor

Part # RC2012
Description  Passive components sales offices
PDF  20 Pages
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

RC2012 Datasheet(HTML) 14 Page - Samsung semiconductor

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background image
0.20±0.10
0.20±0.10
I2
0201x 2R
0201x4R
Inch
RF062P
RF064P
Type
0.80±0.05
1.40±0.05
0.60±0.05
0.60±0.05
0.23±0.10
0.23±0.10
0.30±0.10
0.25±0.10
-
0.25±0.10
Min 0.1
Min 0.1
0.50±0.05
0.35±0.05
0.3
㎎
0.5
㎎
L
W
HA1
A2
D
P
Average
Weight
(UNIT: mm)
26
27
Arrays(Flat Type)
±250
10
Ω~1MΩ
-55
℃~+125℃
70
℃
062P
064P
Type
1/32
Power
Rating
(W)
12.5(V)
25(V)
Working
Voltage
(MAX)
Overload
Voltage
(MAX)
TCR (ppm/℃)
Resistance
Range (Ω)
Rated
Ambient
Temperature
Rated
Working
Temperature
•
Rated voltage (V) =
Rated voltage should be lower than (MAX) working voltage.
√Rated power(W)×Nominal resistance value (Ω)
The rated power is the maximum continuous loading power at 70℃ ambient temperature.
For ambient temperature above 70℃, the loading power follows the below power derating curve.
100
80
60
40
20
0
Operation area
-55
-40
0
40
80
120
Ambient Temperature(
℃)
70
125
•Very Small Array.
•Stable and Accurate Resistance.
•Flat Type Terminal.
The product of lead-free terminal is RoHS compliant.
PhO(lead oxide) is included in the glass of our product which is prescribed
on RoHS appendix as an exception.
•For semiconductor devices.
•For computers, digital circuits.
Feature
Application
Structure and Dimensions
Specification
Power Derating Curve
Land Pattern
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
RF : Flat Type Array
RM : Inverted Type Array
RF
Code Designation
06: 0603
06
Dimension
2P: 2 Pieces
4P: 4 Pieces
4P
Resistors
J:
±5%
J
Tolerance
3 digit coding system
(IEC coding system)
E-24 series
150
Resistance Value
CS : Tape Packaging 7"
ES : Tape Packaging 10"
AS : Tape Packaging 13"
CS
Packaging Code
•The part number system shall be in the following format
Parts Numbering System
Dimension
A
B
2A + B
C
D
062P
064P
0.3
0.3
0.3
0.3
0.9
0.9
0.2
0.2
0.3
0.2
TYPE (Inch)
Reflow Soldering
A
B
A
A
B
A
C
CD
C
CD
: Land Pattern
: Chip Resistor
L
A1
P
H
W
L
W
A2
0.10±0.10
0.10±0.10
I1
0.20±0.10
0.15±0.10
I2
0201x2R
0201x4R
Inch
RM062P
RM064P
Type
0.80±0.05
1.40±0.05
0.60±0.05
0.60±0.05
0.23±0.10
0.23±0.10
0.30±0.10
0.30±0.10
-
0.30±0.10
Min 0.1
Min 0.1
0.50±0.05
0.40±0.05
0.3
㎎
0.5
㎎
L
W
HA1
A2
D
P
Average
Weight
(UNIT: mm)
0.10±0.10
0.10±0.10
I1
P
D
D
A1
I1
I2
I1
Operation
Notes
Example of land
Pattern Design
Recommended
Soldering Conditions
General Structure
General
Precision
Jumper
Low ohms
(RUT Series)
Ultra Low ohms
(RU Series)
Ultra Low Ohms
(RUK Series)
Ultra Low Ohms
(RJ Series)
Arrays
(CONVEX Type)
Arrays
(CONCAVE Type)
Arrays
(FLAT Type)
Anti-Sulfur
Resistors
Attenuator
Characteristics
Performance
Packaging
Standard
Resistance Value
(1) Flat Type Array
(2) Inverted Type Array
H
I2
L
A1
P
H
W
L
W
A2
P
D
D
A1
I1
I2
I1
H
I2



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