© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com

T2005_T491 • 6/12/2014 15

15

Tantalum Surface Mount Capacitors – Standard Tantalum

Soldering Process

KEMET’sfamiliesofsurfacemountcapacitorsarecompatible

withwave(singleordual),convection,IR,orvaporphasereflow

techniques. Preheating of these components is recommended

toavoidextremethermalstress.KEMET'srecommendedprofile

conditionsforconvectionandIRreflowreflecttheprofileconditions

of the IPC/J–STD–020D standard for moisture sensitivity testing.

Thedevicescansafelywithstandamaximumofthreereflow

passes at these conditions.

Please note that although the X/7343–43 case size can withstand

wavesoldering,thetallprofile(4.3mmmaximum)dictatescarein

wave process development.

Handsolderingshouldbeperformedwithcareduetothedifficulty

in process control. If performed, care should be taken to avoid

contact of the soldering iron to the molded case. The iron should

be used to heat the solder pad, applying solder between the pad

andthetermination,untilreflowoccurs.Oncereflowoccurs,the

iron should be removed immediately. “Wiping” the edges of a chip

and heating the top surface is not recommended.

Duringtypicalreflowoperations,aslightdarkeningofthegold-

colored epoxy may be observed. This slight darkening is normal

and not harmful to the product. Marking permanency is not

affected by this change.

Profile Feature

SnPb Assembly Pb-Free Assembly

Preheat/Soak

100°C

150°C

150°C

200°C

60 – 120 seconds

60 – 120 seconds

3°C/secondsmaximum

3°C/secondsmaximum

183°C

217°C

60 – 150 seconds

60 – 150 seconds

220°C*

235°C**

250°C*

260°C**

Timewithin5°CofMaximum

20 seconds maximum

30 seconds maximum

6°C/secondsmaximum

6°C/secondsmaximum

Time25°CtoPeakTemperature

6 minutes maximum

8 minutes maximum

Note: All temperatures refer to the center of the package, measured on the

package body surface that is facing up during assembly reflow.

*Case Size D, E, P, Y, and X

**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z

Storage

Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other

environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term

storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may

increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 60%

relativehumidity.Temperaturefluctuationsshouldbeminimizedtoavoidcondensationonthepartsandatmospheresshouldbefreeof

chlorine and sulphur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within three years

of receipt.

Time

25ºC to Peak

25

Maximum Ramp Up Rate = 3ºC/seconds

Maximum Ramp Down Rate = 6ºC/seconds