LP5522TMXSLASHNOPB datasheet(3/17 Pages) TI1

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LP5522

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SNVS488 – JUNE 2007

Absolute Maximum Ratings

(1) (2)

V (VDD, LED, ISET)

-0.3V to +6.0V

Voltage on logic pin (CTRL)

-0.3V to VDD +0.3V

with 6.0V max

Continuous Power Dissipation (3)

Internally Limited

Junction Temperature (TJ-MAX)

125°C

Storage Temperature Range

-65°C to +150°C

Maximum Lead Temperature (Reflow soldering, 3 times)

260°C

(4)

ESD Rating (5)

Human Body Model

2 kV

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed

performance limits and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=160°C (typ.) and

disengages at TJ=140°C (typ.).

(4)

For detailed soldering specifications and information, please refer to National Semiconductor Application Note AN1112 : Micro SMD

Wafer Level Chip Scale Package.

(5)

The Human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. MIL-STD-883 3015.7

Operating Ratings

(1) (2)

Voltage on power pin (VDD)

2.7V to 5.5V

Recommended Load Current

1 mA to 20 mA

Junction Temperature (TJ) Range

-30°C to +125°C

Ambient Temperature (TA) Range

(3)

-30°C to +85°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed

performance limits and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

Thermal Properties

Junction-to-Ambient Thermal Resistance (

θJA),

87°C/W

TMD06 Package (1)

(1)

.Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

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