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HTMS8x01 Datasheet(PDF) 6 Page - NXP Semiconductors |
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HTMS8x01 Datasheet(HTML) 6 Page - NXP Semiconductors |
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6 / 57 page ![]() HTMS1x01_8x01 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.3 — 17 October 2014 152933 6 of 57 NXP Semiconductors HTMS1x01; HTMS8x01 HITAG µ transponder IC 7. Pinning information Fig 2. HITAG µ - Mega bumps bondpad locations Table 3. HITAG µ - Mega bumps dimensions Description Dimension (X) chip size 550 m (Y) chip size 550 m (1) pad center to chip edge 100.5 m (2) pad center to chip edge 48.708 m (3) pad center to chip edge 180.5 m (4) pad center to chip edge 55.5 m (5) pad center to chip edge 48.508 m 001aaj823 (4) (4) (3) (Y) (X) (2) (5) (6) (6) (1) (1) LA LB |
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