4-7

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Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-

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Die Characteristics

DIE DIMENSIONS:

89 mils x 99 mils x 12 mils

METALLIZATION:

Type: Al

Thickness: 10k

Å

PASSIVATION:

Type: PSG Over Nitride

PSG Thickness: 7k

Å

Nitride Thickness: 8k

Å

WORST CASE CURRENT DENSITY:

Metallization Mask Layouts

DG300A

DG301A

DG303A

PIN 2

D1

PIN 4

S1

PIN 7

GND

PIN 9

IN 2

PIN 13

D2

PIN 14

V+

PIN 11

S2

PIN 8

NC

PIN 6

IN 1

V-

PIN 2

D1

PIN 4

S1

PIN 13

D2

PIN 14

V+

PIN 11

S2

PIN 6

IN 1

PIN 7

GND

PIN 8

NC

V-

PIN 2

S3

PIN 4

D1

PIN 9

IN 2

PIN 14

V+

PIN 12

D4

PIN 6

IN 1

PIN 3

D3

PIN 5

S1

PIN 11

D2

PIN 10

S2

PIN 13

S4

PIN 7

GND

PIN 8

NC

V-

DG300A, DG301A, DG303A