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HCS139MS Datasheet(PDF) 9 Page - Intersil Corporation |
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HCS139MS Datasheet(HTML) 9 Page - Intersil Corporation |
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9 / 9 page ![]() 161 HCS139MS Die Characteristics DIE DIMENSIONS: 106 mils x 108 mils x 19 mils 1 mils METALLIZATION: Type: SiAl Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 mils x 4 mils Metallization Mask Layout HCS139MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCS139 is TA14309A. (14) 2A0 (13) 2A1 (12) 2Y0 (11) 2Y1 (10) 2Y2 1A1 (3) 1Y0 (4) 1Y1 (5) 1Y2 (6) Spec Number 518832 |
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