| Electronic Components Datasheet Search |
|
HCS165K Datasheet(PDF) 9 Page - Intersil Corporation |
|
|
|||||||||||||||||||||||||||||
HCS165K Datasheet(HTML) 9 Page - Intersil Corporation |
|
9 / 9 page ![]() 248 HCS165MS Die Characteristics DIE DIMENSIONS: 95 x 94 mils METALLIZATION: Type: AlSi Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: < 2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 x 4 mils Metallization Mask Layout HCS165MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCS165 is TA14385A. CP PL VCC D4 (3) D5 (4) D6 (5) (6) (8) (9) (10) (11) D0 (12) D1 (13) D2 (14) (2) (1) (16) GND Q7 DS (7) (15) D7 Q7 D3 CE Spec Number 518757 |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |