HIP0045 datasheet(3/10 Pages) INTERSIL

3 / 10 page

4-3

Absolute Maximum Ratings

Thermal Information

Maximum Output Voltage, VOUT . . . . . . . . . . . . . . . . . . .-0.7 to VOC

Peak Output Load Current, ILOAD . . . . . As Speciﬁed for ISC, ILIM

Continuous Output Load Current, IOUT (All 8 Outputs ON) . . . . 0.5A

Continuous Output Load Current, IOUT (Any one Output ON) . . 1A

Total Average Current, IOUT (All 8 Outputs) . . . . . . . . . . . . . . . 4.5A

Reverse Peak Current Drive, Any one Output, IRD; t ≤ 2ms . . . -3A

DC Logic Supply, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 7V

Input Voltage, All Inputs and Data Lines . . . . . . . -0.3 to VCC +0.3V

Operating Conditions

Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 125oC

Logic Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . 4.5V to 5.5V

Thermal Resistance (Typical, Note 6)

θJA (oC/W) θJC (oC/W)

PSOP Package . . . . . . . . . . . . . . . . . .

Maximum Junction Temperature, TJ . . . . . . . . . . . . . . . . . . . .150

Maximum Storage Temperature Range, TSTG . . . . -55

oC to 150oC

Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .265oC

Die Characteristics

Back Side Potential . . . . . . . . . . . . . . . . . . .V- (GND Pin, Heat Sink)

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operationofthe

device at these or any other conditions above those indicated in the operational sections of this speciﬁcation is not implied.

NOTE:

θJA Rated with standard PC Board, θJC rated with infinite heat sink.

Electrical Speciﬁcations

VCC = 4.5V to 5.5V, TA = -40

oC to 125oC, Unless Otherwise Speciﬁed

PARAMETER

SYMBOL

TEST CONDITIONS

MIN

TYP

MAX

UNITS

Standby Current, No Load

ICCO

No Load

Supply Current, Full Load

ICC

All Outputs ON, 0.5A Load Per Output

Output Clamping Voltage (Note 7)

VOC

ILOAD = 0.5A, Output Programmed OFF

Output Clamping Energy

EOC

1ms Single Pulse Width, TA = 25

oC,

(Refer to Figure 4 for SOA)

Output Leakage Current 1 (Note 8)

IO LEAK1 VOUT = 25V, Outputs OFF

100

µA

Output Leakage Current 2 (Note 8)

IO LEAK2 VOUT = 16V, Outputs OFF

100

µA

Output Leakage Current 3 (Note 8)

IO LEAK3 VOUT = 16V, Outputs OFF, VCC = 1V

µA

Drain-to-Source On Resistance, OUT0 - 7

rDSON

ILOAD = 0.5A; TJ = 150

1.5

Ω

Output Capacitance

COUT

VOUT = 16V, f = 1MHz

Turn-On Delay, OUT0, 1

td(ON)

RL = 500Ω, VCE = 50% to VOUT = 0.9 x VBATT,

VIN0,1 = 50% to VOUT = 0.9 x VBATT,

VBATT = 16V

µs

Turn-On Delay, OUT2 - 7

td(ON)

RL = 500Ω, VCE = 50% to VOUT = 0.9 x VBATT,

VBATT = 16V

µs

Turn-Off Delay

td(OFF)

RL = 500Ω, VCE = 50% to VOUT = 0.1 x VBATT,

VIN0,1 = 50% to VOUT = 0.9 x VBATT,

VBATT = 16V

µs

Turn-On Voltage Slew-Rate, OUT2 - 7

For VOUT = 90% to 30% of VBATT; VBATT = 16V,

RL = 500Ω

0.7

3.5

µs

Turn-On Voltage Slew-Rate, OUT0, 1

For VOUT = 90% to 30% of VBATT; VBATT = 16V,

RL = 500Ω

µs

Turn-Off Voltage Slew-Rate, OUT0 - 7

For VOUT = 30% to 90% of VBATT; VBATT = 16V,

RL = 500Ω

µs

Turn-Off Voltage Slew-Rate, OUT0 - 7

For VOUT = 30% to 80% of VOC;

VBATT = 0.9 x VOC, RL = 500Ω

µs

FAULT PARAMETERS

Reverse Current Drive, OUT0 - 7

IRD

-500

Reverse Voltage Drop, OUT0 - 7

VRD

IOUT = -3A, t ≤2ms

-1.5

∆ICC during Reverse Current Drive

∆ICC

IOUT = -3A, t ≤2ms

100

ON1

-------------------

ON2

-------------------

OFF1

----------------------

OFF2

----------------------

HIP0045

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