4

HIP1031

Single-In-Line Plastic Packages (SIP)

D

L

e

b

A

c

E

3

Q

2

14

5

5 LEAD PLASTIC SINGLE-IN-LINE PACKAGE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A

0.170

0.180

4.32

4.57

-

0.048

0.052

1.22

1.32

3, 4

b

0.030

0.034

0.77

0.86

3, 4

0.031

0.041

0.79

1.04

3, 4

c

0.018

0.022

0.46

0.55

3, 4

D

0.590

0.610

14.99

15.49

-

E

0.395

0.405

10.04

10.28

-

e

0.067 TYP

1.70 TYP

5

0.268 BSC

6.80 BSC

5

0.235

0.255

5.97

6.47

-

0.095

0.105

2.42

2.66

6

L

0.530

0.550

13.47

13.97

-

0.110

0.130

2.80

3.30

2

ØP

0.149

0.153

3.79

3.88

-

Q

0.105

0.115

2.66

2.92

-

Rev. 1 4/96

NOTES:

1. These dimensions are within allowable dimensions of Rev. A of

JEDEC TS-001AA outline dated 8-89.

2. Solder finish uncontrolled in this area.

3. Lead dimension (without solder).

4. Add typically 0.002 inches (0.05mm) for solder plating.

5. Position of lead to be measured 0.250 inches (6.35mm) from

bottom of dimension D.

6. Position of lead to be measured 0.100 inches (2.54mm) from

bottom of dimension D.

7. Controlling dimension: Inch.

All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without

notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate

and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which

may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see web site http://www.intersil.com