ADG784

Rev. A | Page 9

OUTLINE DIMENSIONS

Figure 37. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

4 mm × 4 mm Body, Very Very Thin Quad

(CP-20-6)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADG784BCPZ

−40°C to +85°C

20-Lead LFCSP_WQ

CP-20-6

ADG784BCPZ-REEL

−40°C to +85°C

20-Lead LFCSP_WQ

CP-20-6

ADG784BCPZ-REEL7

−40°C to +85°C

20-Lead LFCSP_WQ

CP-20-6

REVISION HISTORY

2/13—Rev. 0 to Rev. A

Changes to Pin Configuration.........................................................4

Updated Outline Dimensions..........................................................9

Changes to Ordering Guide.............................................................9

4/01—Revision 0: Initial Version

0.50

BSC

0.65

0.60

0.55

0.30

0.25

0.18

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGD-1.

BOTTOM VIEW

TOP VIEW

EXPOSED

PAD

PIN 1

INDICATOR

4.10

4.00 SQ

3.90

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

0.20 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

2.30

2.10 SQ

2.00

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

1

20

6

10

11

15

16

5

©2013 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D02374-0-2/13(A)