FEATURES

• For surface mounted applications

• Low profile package

• Ideal for automated placement

• High temperature soldering : 260°C /10 seconds at terminals

• Glass Passivated Chip Junction

• In compliance with EU RoHS 2002/95/EC directives

MECHANICAL DATA

• Terminals: Solderable per MIL-STD-750, Method 2026

NOTES: 1.

2.Soldering land: 6mm x 6mm

VOLTAGE

50 to 1000 Volts

1.0 Amperes

CURRENT

F1

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25°C ambient temperature unless otherwise specified.

DATA SHEET

Case:SOD-123S,Molded Plastic over passivated junction

F2

F3

F4

F5

F6

F7

SOD-123S

0.014(0.35)

MIN

0.112(2.85)

0.047(1.20)

0.100(2.55)

MAX

0.152(3.85)

0.140(3.55)

Unit:inch(mm)

GPP SURFACE MOUNT FAST RECOVERY RECTIFIER

FF1AS THRU FF1MS

SYMBOL

Maximum Recurre nt Peak Reverse V oltage

50

100

200

400

600

800

1000

Volts

Maximum RMS Voltage

35

70

140

280

420

560

700

Volts

Maximum DC Blo cking Voltage

50

100

200

400

600

800

1000

Volts

Maximum Average Forw a rd Rect ified Current at TA = 55

1.0

Amps

Peak Forward Surge Current 8.3 ms single half sine-wave

superimposed on rated load(JEDEC Method)

30

Amps

Maximum Forward Voltage at 1.0A DC

1.30

s

tl

o

V

@TA = 25

5.0

Maximum DC Reverse Current at

Rated DC Blocking Voltage

@TA = 125

150

uAmps

Maximum Reverse Recovery Time

150

250

500

nSec

Maxi mum Thermal Resi stance (Note 2)

30

Typical Junction Capacitance (Note 1)

15

pF

Operating and Storage Temperature Range

-55 to +150

FF1AS

FF1BS FF1DS

FF1GS

FF1JS

FF1KS FF1MS

SEMICONDUCTOR

R

θ JL

°C

°C / W

http://www.yeashin.com

1

REV.03 20141119

PARAMETER

Marking Code

°C

°C

UNITS

Typical thermal resistance(Note 2)

R

θ JA

65

°C / W

°C

°C

H

F(AC)

I

Measured at 1 MHz and applied reverse voltage of 4.0 VDC