C-409

CPV362MM

Short Circuit Rated Fast IGBT

IGBT SIP MODULE

Parameter

Typ.

Max.

Units

Junction-to-Case, each IGBT, one IGBT in conduction

—

5.5

Junction-to-Case, each diode, one diode in conduction

—

9.0

°C/W

Case-to-Sink, flat, greased surface

0.1

—

Wt

Weight of module

20 (0.7)

—

g (oz)

Thermal Resistance

Features

•

Fully isolated printed circuit board mount package

• Switching-loss rating includes all "tail" losses

• HEXFRED

• Optimized for medium operating frequency (1 to

10kHz) See Fig. 1 for Current vs. Frequency curve

Product Summary

Output Current in a Typical 5.0 kHz Motor Drive

Power Factor 0.8, Modulation Depth 80% (See Figure 1)

3

6

7

13

19

18

15

10

16

4

9

12

D1

D3

D5

D2

D4

D6

Q1

Q2

Q3

Q4

Q5

Q6

1

PD - 5.031

The IGBT technology is the key to International Rectifier's advanced line of IMS

(Insulated Metal Substrate) Power Modules. These modules are more efficient

than comparable bipolar transistor modules, while at the same time having the

simpler gate-drive requirements of the familiar power MOSFET. This superior

technology has now been coupled to a state of the art materials system that

maximizes power throughput with low thermal resistance. This package is highly

suited to power applications and where space is at a premium.

These new short circuit rated devices are especially suited for motor control and

other totem-pole applications requiring short circuit withstand capability.

Description

Absolute Maximum Ratings

Parameter

Max.

Units

Collector-to-Emitter Voltage

600

V

Continuous Collector Current, each IGBT

7.9

Continuous Collector Current, each IGBT

4.6

Pulsed Collector Current

16

A

Clamped Inductive Load Current

16

Diode Continuous Forward Current

3.4

Diode Maximum Forward Current

16

Short Circuit Withstand Time

10

µs

Gate-to-Emitter Voltage

± 20

V

Isolation Voltage, any terminal to case, 1 minute

2500

Maximum Power Dissipation, each IGBT

23

W

Maximum Power Dissipation, each IGBT

9.1

Operating Junction and

-40 to +150

Storage Temperature Range

°C

Soldering Temperature, for 10 sec.

300 (0.063 in. (1.6mm) from case)

Mounting torque, 6-32 or M3 screw.

5-7 lbf•in (0.55 - 0.8 N•m)

IMS-2

Revision 2

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