● SOP-8FD Power Dissipation

Power dissipation data for the SOP-8FD is shown in this page. The value of power dissipation varies with the mount board conditions.

Please use this data as one of reference data taken in the described condition.

40.0

2.54

1.4

28.9

1.

Measurement Condition (Reference data)

Condition:

Mount on a board

Ambient:

Natural convection

Soldering:

Lead (Pb) free

Board:

Dimensions 40 x 40 mm (1600 mm2 in one side)

Copper (Cu) traces occupy 50% of the board area

In top and back faces

Package heat-sink is tied to the copper traces

Material:

Glass Epoxy (FR-4)

Thickness:

1.6 mm

Through-hole:

4 x 0.8 Diameter

Evaluation Board (Unit: mm)

2. Power Dissipation vs. Ambient temperature (85℃)

Board Mount (Tj max = 125℃)

P

3. Power Dissipation vs. Ambient temperature (105℃)

Board Mount (Tj max = 125℃)

Ambient

Temperature

（℃）

Power

Dissipation Pd

（mW）

Thermal

Resistance

(℃/W)

25

1500

85

600

66.67

d-Ta特性グラフ

0

200

400

600

800

1000

1200

1400

1600

25

45

65

85

105

125

Pd-Ta特性グラフ

0

200

400

600

800

000

1200

400

1600

25

45

65

85

105

125

Ambient

Temperature

（℃）

Power

Dissipation Pd

（mW）

Thermal

Resistance

(℃/W)

25

1500

105

300

66.67

1

1

周囲温度Ta（℃）

周囲温度Ta（℃）

Ambient Temperature Ta（℃）

Pd vs. Ta

Pd vs. Ta

Ambient Temperature Ta（℃）