March 2014

DocID12707 Rev 5

1/9

TN0018

Technical note

Surface mounting guidelines for MEMS sensors

in an LGA package

Introduction

This technical note provides general guidelines for soldering MEMS sensor products

housed in an LGA surface-mount package.

Note:

Information provided in this document is to be intended for use as reference material

concerning PCB design and soldering processes. For device specifications, refer to the

corresponding datasheet.

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