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µPD4724

RECOMMENDED SOLDERING CONDITIONS

The following conditions (see table below) must be met when soldering this product. Please consult with

our sales offices in case other soldering process is used, or in case soldering is done under different

conditions.

TYPES OF SURFACE MOUNT DEVICE

For more details, refer to our document "SMT MANUAL" (C10535E).

µPD4724GS-GJG

Soldering

Soldering conditions

Symbol

process

Infrared ray

Peak package's surface temperature: 230

°C or below,

IR30-00-2

reflow

Reflow time: 30 seconds or below (210

°C or higher),

Number of reflow process: 2, Exposure limit*: None

VPS

Peak package's surface temperature: 215

°C or below,

VP15-00-2

Reflow time: 40 seconds or below (200

°C or higher),

Number of reflow process: 2,

Exposure limit*: None

Wave

Solder temperature: 260

°C or below,

WS60-00-1

soldering

Flow time: 10 seconds or below,

Number of flow process: 1,

Exposure limit*: None

Partial

Terminal temperature: 300

°C or below,

heating

Flow time: 10 seconds or below,

method

Exposure limit*: None

* Exposure limit before soldering after dry-pack package is opened.

Sotrage conditions: 25

°C and relative humidity at 65 % or less.

Note

Do not apply more than a single process at once, except for “Partial heating method”.