AN626 datasheet(3/5 Pages) STMICROELECTRONICS

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DocID5663 Rev 6

3/5

AN626

For complete details of the correct product number, and ordering codes, for a specific

product, please contact your nearest ST sales office or distributor.

Table 6. Field E, 9th and 10th characters, package (two letters used in every case)

Package code

Package type

PSDIP8 standard

CS, CU

WLCSP (Chip scale package)

Thin WLCSP (Chip scale package)

TSSOP8

SO8 narrow 0.150 mils

MC or MF

UFDFPN8 (MLP8)

UFDFPN5 (MLP5)

Table 7. Field F, 11th character, temperature range

Device grade

Temperature range

0 °C to 70 °C

–40 °C to +125 °C, with a certified reliability flow tailored for automotive applications

–40 °C to +85 °C

–40 °C to +105 °C

Table 8. Field G, 12th, packing option

Option code

Option

Blank

Standard packing

Tape and reel packing

Table 9. Field H, 13th, plating technology

Code

Plating technology

P or G

ECOPACK® (RoHS compliant)

Back side coating (for WLCSP packages)

Table 10. Field J, 14th, die process

Code

Plating technology

G or S

F6SP

B or P

F6DP

AF8L

K or T

F8H

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