List of figures

AN1294

4/20

Doc ID 7604 Rev 3

List of figures

Figure 1.

LDMOS structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 2.

PowerSO-10RF package construction (JEDEC MO-184 standard) . . . . . . . . . . . . . . . . . . . 6

Figure 3.

PowerSO-10RF straight and formed lead versions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 4.

PD57045S-E in PowerSO-10RF versus SD57045-01 in ceramic package . . . . . . . . . . . . . 9

Figure 5.

Power gain versus output power/ceramic vs. plastic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Figure 6.

Power gain versus output power/straight leads vs. formed leads. . . . . . . . . . . . . . . . . . . . 10

Figure 7.

Recommended heat profile/reflow soldering for PSO10RF lead-free. . . . . . . . . . . . . . . . . 14

Figure 8.

PowerSO-10RF recommended pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 9.

PowerSO-10RF recommended pad layout with via holes . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 10.

Mounting on copper base plate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16