11

LT1795

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

Dimensions in millimeters (inches) unless otherwise noted.

PACKAGE DESCRIPTIO

FE Package

20-Lead Plastic TSSOP (4.4mm)

(LTC DWG # 05-08-1663)

FE20 TSSOP 0200

0.09 – 0.18

(0.0035 – 0.0071)

0

° – 8°

0.50 – 0.70

(0.020 – 0.028)

4.30 – 4.48**

(0.169 – 0.176)

6.25 – 6.50

(0.246 – 0.256)

3.0

(0.118)

34

5

6 7 8

11

12

14 13

6.40 – 6.60*

(0.252 – 0.260)

5.12

(0.202)

20 19 18 17 16 15

1.15

(0.453)

MAX

0.05 – 0.15

(0.002 – 0.006)

0.65

(0.0256)

BSC

0.18 – 0.30

(0.0071 – 0.0118)

2

NOTE: DIMENSIONS ARE IN MILLIMETERS

DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.152mm (0.006") PER SIDE

DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD

FLASH SHALL NOT EXCEED 0.254mm (0.010") PER SIDE

*

**

9 10

1