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UPD7564ACSA Datasheet(PDF) 49 Page - NEC |
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UPD7564ACSA Datasheet(HTML) 49 Page - NEC |
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49 / 56 page ![]() 49 µPD7564A, 7564A(A) 10. RECOMMENDED PACKAGING PATTERN OF SOP (REFERENCE) (UNIT: mm) 7.62 1.27 • This recommended pattern conforms to the General Rules for Integrated Citrcuit Outer Shape (IC-74-2) specified by the Electronic Industries Association of Japan (EIAJ). • The above pattern dimensions are applicable to all the products designated as EIAJ flat DIP (mini flat) of “Form A 300 mil type”. • If there is any possibility of causing a solder bridge, adjust the width (0.76) of each pad while maintaining the same length (1.27). |
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