CREAT BY ART

- Glass passivated chip junction

- Ideal for automated placement

- Low forward voltage drop

- Ultrafast recovery time for high efficiency

- Built-in strain relief

- Halogen-free according to IEC 61249-2-21 definition

Molding compound, UL flammability classification rating 94V-0

Base P/N with suffix "G" on packing code - Green compound (halogen-free)

Base P/N with prefix "H" on packing code - AEC-Q101 qualified

Terminal:

Matte tin plated leads, solderable per JESD22-B102

Meet JESD 201 class 1A whisker test

with prefix "H" on packing code meet JESD 201 class 2 whisker test

50

100

200

400

600

800

1000

V

35

70

140

280

420

560

700

V

50

100

200

400

600

800

1000

V

A

Trr

ns

Cj

pF

Document Number: DS_D1405051

Version: J14

US1A thru US1M

Taiwan Semiconductor

High Efficient Surface Mount Rectifiers

FEATURES

- Moisture sensitivity level: level 1, per J-STD-020

- Compliant to RoHS Directive 2011/65/EU and

in accordance to WEEE 2002/96/EC

MECHANICAL DATA

Case:

DO-214AC (SMA)

DO-214AC (SMA)

Polarity:

Indicated by cathode band

Weight:

0.06 g (approximately)

Maximum repetitive peak reverse voltage

PARAMETER

SYMBOL

US

1A

US

1B

US

1D

30

US

1J

US

1K

US

1M

UNIT

US

1G

A

Maximum instantaneous forward voltage (Note 1)

@ 1 A

1.0

V

Maximum RMS voltage

Maximum DC blocking voltage

Maximum average forward rectified current

1

Peak forward surge current, 8.3 ms single half sine-wave

superimposed on rated load

Maximum reverse recovery time (Note 2)

Typical junction capacitance (Note 3)

5

μA

150

Typical thermal resistance

Operating junction temperature range

- 55 to +150

Storage temperature range

- 55 to +150

27

75

Note 1: Pulse test with PW=300μs, 1% duty cycle

Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.

1.7

50

75

15

10