11

LTC485

PACKAGE DESCRIPTIO

Dimensions in inches (millimeters) unless otherwise noted.

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

N8 Package

8-Lead Plastic DIP

N8 0392

0.045 ± 0.015

(1.143 ± 0.381)

0.100 ± 0.010

(2.540 ± 0.254)

0.065

(1.651)

TYP

0.045 – 0.065

(1.143 – 1.651)

0.130 ± 0.005

(3.302 ± 0.127)

0.020

(0.508)

MIN

0.018 ± 0.003

(0.457 ± 0.076)

0.125

(3.175)

MIN

12

3

4

87

6

5

0.250 ± 0.010

(6.350 ± 0.254)

0.400

(10.160)

MAX

0.009 – 0.015

(0.229 – 0.381)

0.300 – 0.320

(7.620 – 8.128)

0.325

+0.025

–0.015

+0.635

–0.381

8.255

()

1

2

3

4

0.150 – 0.157

(3.810 – 3.988)

8

7

6

5

0.189 – 0.197

(4.801 – 5.004)

0.228 – 0.244

(5.791 – 6.197)

0.016 – 0.050

0.406 – 1.270

0.010 – 0.020

(0.254 – 0.508)

× 45°

0°– 8° TYP

0.008 – 0.010

(0.203 – 0.254)

SO8 0392

0.053 – 0.069

(1.346 – 1.752)

0.014 – 0.019

(0.355 – 0.483)

0.004 – 0.010

(0.101 – 0.254)

0.050

(1.270)

BSC

S8 Package

8-Lead Plastic SOIC