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DMN601DMK Datasheet(PDF) 2 Page - Diodes Incorporated

Part # DMN601DMK
Description  DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
PDF  5 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

DMN601DMK Datasheet(HTML) 2 Page - Diodes Incorporated

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DMN601DMK
Document number: DS30657 Rev. 5 - 2
2 of 5
www.diodes.com
November 2011
© Diodes Incorporated
DMN601DMK
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Units
Drain-Source Voltage
VDSS
60
V
Gate-Source Voltage
VGSS
±20
V
Continuous Drain Current (Note 5) VGS = 10V
Steady
State
TA = 25°C
TA = 70°C
ID
510
400
mA
t<10s
TA = 25°C
TA = 70°C
ID
580
470
mA
Continuous Drain Current (Note 5) VGS = 4V
Steady
State
TA = 25°C
TA = 70°C
ID
390
300
mA
t<10s
TA = 25°C
TA = 70°C
ID
440
340
mA
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
IDM
850
mA
Maximum Body Diode Continuous Current
IS
1.2
A
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Units
Total Power Dissipation (Note 4)
PD
0.7
W
Thermal Resistance, Junction to Ambient (Note 4)
Steady state
RθJA
157
°C/W
t<10s
121
Total Power Dissipation (Note 5)
PD
0.98
W
Thermal Resistance, Junction to Ambient (Note 5)
Steady state
RθJA
113
°C/W
t<10s
88
Thermal Resistance, Junction to Case (Note 5)
RθJC
26
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
BVDSS
60
⎯
⎯
V
VGS = 0V, ID = 10μA
Zero Gate Voltage Drain Current
IDSS
⎯
⎯
1
μA
VDS = 60V, VGS = 0V
Gate-Source Leakage
IGSS
⎯
⎯
±10
μA
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
VGS(th)
1.0
1.6
2.5
V
VDS = 10V, ID = 1mA
Static Drain-Source On-Resistance
RDS (ON)
⎯
⎯
⎯
2.4
4.0
Ω
VGS = 10V, ID = 200mA
VGS = 4V, ID = 200mA
Forward Transfer Admittance
|Yfs|
100
⎯
⎯
ms
VDS =10V, ID = 200mA
Diode Forward Voltage
VSD
0.5
⎯
1.4
V
VGS = 0V, IS = 115mA
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
Ciss
⎯
30
50
pF
VDS = 25V, VGS = 0V
f = 1.0MHz
Output Capacitance
Coss
⎯
5
25
pF
Reverse Transfer Capacitance
Crss
⎯
3
5.0
pF
Gate Resistance
Rg
⎯
133
⎯
Ω
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge
Qg
⎯
304
⎯
nC
VGS = 4.5V, VDS = 10V,
ID = 250mA
Gate-Source Charge
Qgs
⎯
84
⎯
Gate-Drain Charge
Qgd
⎯
203
⎯
Turn-On Delay Time
tD(on)
⎯
3.9
⎯
ns
VDS = 30V, ID = 0.2A,
VGS = 10V, RG = 25Ω, RL = 150Ω
Turn-On Rise Time
tr
⎯
3.4
⎯
Turn-Off Delay Time
tD(off)
⎯
15.7
⎯
Turn-Off Fall Time
tf
⎯
9.9
⎯
Notes:
4. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate
6. Short duration pulse test used to minimize self-heating effect
7. Guaranteed by design. Not subject to production testing



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