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RFPA5026 Datasheet(PDF) 13 Page - RF Micro Devices |
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RFPA5026 Datasheet(HTML) 13 Page - RF Micro Devices |
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13 / 16 page ![]() 13 of 16 RFPA5026 DS121114 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com. Evaluation Board Layout and Bill of Materials 5.15GHz to 5.35GHz Evaluation Board Layout for V+= VCC=VPC=5.0V, IQ=563mA PCB Notes: Do not use less than the recommended number of via holes under the device ground paddle. RF layers thicker than 0.020 inches )0.5mm) not recommended. Bill of Materials DESG Description Notes Q1 RFPA5026 DFN R1 750 , 0603 1% 0402 may be used. R2 0 , 0603 0402 may be used. R3 2.80K , 0603 1% 0402 may be used. R4 47K , 0603 0402 may be used. C1 1uF 16V MLCC CAP Tantulum ok for EVM performance. Use MLCC type for best IM3 levels. C2 1.8pF CAP, 0603 NPO, ROHM MCH185A1R8DK or equiv. C3, 4 0.1uF CAP, 0603 X7R 0402 ok, ROHM MCH182CN104K or equiv. C5 4.7pF CAP, 0603 NPO, low ESR, ATC 600S4R7CW250 or equiv. C6 0.7pF CAP, 0603 NPO, low ESR, ATC 600S0R7CW250 or equiv. C7 5.6pF CAP, 0603 NPO, low ESR, ATC 600S5R6CW250 or equiv. L1 5.6nH IND, 0805 Coilcraft 0805-HQ-5N6XJBB |
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