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F25L02PA Datasheet(PDF) 9 Page - Elite Semiconductor Memory Technology Inc. |
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F25L02PA Datasheet(HTML) 9 Page - Elite Semiconductor Memory Technology Inc. |
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9 / 35 page ![]() ESMT F25L02PA Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2013 Revision: 1.2 9/35 INSTRUCTIONS Instructions are used to Read, Write (Erase and Program), and configure the F25L02PA. The instruction bus cycles are 8 bits each for commands (Op Code), data, and addresses. Prior to executing any Page Program, Write Status Register, Sector Erase, Block Erase, or Chip Erase instructions, the Write Enable (WREN) instruction must be executed first. The complete list of the instructions is provided in Table 5. All instructions are synchronized off a high to low transition of CE . Inputs will be accepted on the rising edge of SCK starting with the most significant bit. CE must be driven low before an instruction is entered and must be driven high after the last bit of the instruction has been shifted in (except for Read, Read ID, Read Status Register, Read Electronic Signature instructions). Any low to high transition on CE , before receiving the last bit of an instruction bus cycle, will terminate the instruction in progress and return the device to the standby mode. Instruction commands (Op Code), addresses, and data are all input from the most significant bit (MSB) first. Table 5: Device Operation Instructions Bus Cycle 1~3 1 2 3 4 5 6 N Operation Max. Freq SIN SOUT SIN SOUT SIN SOUT SIN SOUT SIN SOUT SIN SOUT SIN SOUT Read 33 MHz 03H Hi-Z A23-A16 Hi-Z A15-A8 Hi-Z A7-A0 Hi-Z X DOUT0 X DOUT1 X cont. Fast Read 0BH Hi-Z A23-A16 Hi-Z A15-A8 Hi-Z A7-A0 Hi-Z X X X DOUT0 X cont. Fast Read Dual Output 11,12 3BH A23-A16 A15-A8 A7-A0 X DOUT0~1 cont. Sector Erase 4 (4K Byte) 20H Hi-Z A23-A16 Hi-Z A15-A8 Hi-Z A7-A0 Hi-Z - - - - - - Block Erase 4, (64K Byte) D8H Hi-Z A23-A16 Hi-Z A15-A8 Hi-Z A7-A0 Hi-Z - - - - - - Chip Erase 60H / C7H Hi-Z - - - - - - - - - - - - Page Program ( PP) 02H Hi-Z A23-A16 Hi-Z A15-A8 Hi-Z A7-A0 Hi-Z DIN0 Hi-Z DIN1 Hi-Z Up to 256 bytes Hi-Z Read Status Register ( RDSR) 6 05H Hi-Z X DOUT - - - - - - - - - - Write Status Register ( WRSR) 01H Hi-Z DIN Hi-Z - - -. - - - - - - - Write Enable ( WREN) 9 06H Hi-Z - - - - - - - - - - - - Write Disable ( WRDI) 04H Hi-Z - - - - - - - - - - - - Deep Power Down ( DP) B9h Hi-Z - - - - - - - - - - - - Release from Deep Power Down ( RDP) ABH Hi-Z - - - - - - - - - - - - Read Electronic Signature ( RES) 7 ABH Hi-Z X X X X X X X 11H - - - - Jedec Read ID ( JEDEC-ID) 8 9FH Hi-Z X 8CH X 30H X 12H - - - - - - 00H Hi-Z X 8CH X 11H - - Read ID ( RDID) 10 50MHz ~ 100MHz 90H Hi-Z 00H Hi-Z 00H Hi-Z 01H Hi-Z X 11H X 8CH - - Note: 1. Operation: SIN = Serial In, SOUT = Serial Out, Bus Cycle 1 = Op Code 2. X = Dummy Input Cycles (VIL or VIH); - = Non-Applicable Cycles (Cycles are not necessary); cont. = continuous 3. One bus cycle is eight clock periods. 4. Sector Earse addresses: use AMS -A12, remaining addresses can be VIL or VIH Block Earse addresses: use AMS -A16, remaining addresses can be VIL or VIH 5. To continue programming to the next sequential address location, enter the 8-bit command, followed by the data to be programmed. 6. The Read-Status-Register is continuous with ongoing clock cycles until terminated by a low to high transition on CE . 7. The Read-Electronic-Signature is continuous with on going clock cycles until terminated by a low to high transition on CE . 8. The Jedec-Read-ID is output first byte 8CH as manufacture ID; second byte 30H as memory type; third byte 12H as memory capacity. 9. The Write-Enable (WREN) instruction and the Write-Status-Register (WRSR) instruction must work in conjunction of each other. The WRSR instruction must be executed immediately (very next bus cycle) after the WREN instruction to make both |
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