NICHIA STS-DA1-3538B <Cat.No.150417>

9

* If the top cover tape is removed right next to where the nozzle picks up the LEDs, regardless of whether the LEDs have been baked

or not, it may cause the LED to be picked up incorrectly; it is recommended to remove the top cover tape further

from where the nozzle picks up the LEDs. Ensure that there are no issues with the conditions when the nozzle picks up the LEDs.

● Recommended Tape Removal Position(Removing the cover tape further from the pick-and-place nozzle)

吸着ノズル

Pick-and-place nozzle

キャリアテープ引き出し方向

Feed Direction of the Carrier Tape

テープ剥離位置

Tape Removal Position

製品テープ

Top Cover Tape

● Incorrect Tape Removal Position(Removing the cover tape right next to the pick-and-place nozzle)

製品テープ

Top Cover Tape

吸着ノズル

Pick-and-place nozzle

テープ剥離位置

Tape Removal Position

キャリアテープ引き出し方向

Feed Direction of the Carrier Tape

* Verify the setting conditions when the LEDs are mounted onto a PCB to ensure that the LEDs are mounted onto the PCB

with the correct polarity. If the cathode mark is not able to be easily recognized with a visual inspection,

check the back or side of the LED to determine the polarity.

* The recommended soldering pad pattern is designed for attachment of the LED without problems.

When precise mounting accuracy is required, such as high-density mounting, ensure that the size and shape of the pad

are suitable for the circuit design.

* Consider factors such as the reflow soldering temperature, hand soldering temperature, etc. when choosing the solder.

* When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner

where the flux will come in contact with the LEDs.

* Make sure that there are no issues with the type and amount of solder that is being used.

* All of the electrode pads are on the backside of this product; solder connections will not be able to be seen nor confirmed

by a normal visual inspection. When using the product, ensure that there are no issues with the soldering conditions.