CYStech Electronics Corp.

Spec. No. : C769HT

Issued Date : 2014.04.29

Revised Date : 2014.06.06

Page No. : 3/ 3

MB05ST05 thru MB10ST05

CYStek Product Specification

MBST Dimension

Marking :

MBST Plastic Surface

Mounted Package

CYStek Package Code: HT

XX

□□□□□

Date Code

Device Name

Type

MB05ST05 MB1ST05 MB2ST05 MB4ST05 MB6ST05 MB8ST05 MB10ST05

Marking

MB05S

MB1S

MB2S

MB4S

MB6S

MB8S

MB10S

Inches

Millimeters

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.165

0.181

4.200

4.600

F

-

0.008

-

0.200

B

0.023

0.031

0.600

0.800

G

-

0.275

-

7.000

C

0.177

0.193

4.500

4.900

J

0.006

0.010

0.150

0.250

D

0.049

0.057

1.250

1.450

L

-

0.650

-

1.650

E

0.900

0.106

2.300

2.700

Q

0.024

0.028

0.600

0.700

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material :

• Lead : Pure tin plated.

• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.