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MAX4312EEE Datasheet(PDF) 13 Page - Maxim Integrated Products

Part # MAX4312EEE
Description  High-Speed, Low-Power, Single-Supply, Multichannel, Video Multiplexer-Amplifiers
PDF  20 Pages
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX4312EEE Datasheet(HTML) 13 Page - Maxim Integrated Products

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High-Speed, Low-Power, Single-Supply,
Multichannel, Video Multiplexer-Amplifiers
______________________________________________________________________________________
13
Low-Power Shutdown Mode
All parts feature a low-power shutdown mode that is
activated by driving the SHDN input low. Placing the
amplifier in shutdown mode reduces the quiescent sup-
ply current to 560µA and places the output into a high-
impedance state, typically 35k
Ω. By tying the outputs
of several devices together and disabling all but one of
the paralleled amplifiers’ outputs, multiple devices may
be paralleled to construct larger switch matrices.
For MAX4310/MAX4311/MAX4312 application circuits
operating with a closed-loop gain of +2V/V or greater,
consider the external-feedback network impedance of
all devices used in the mux application when calculat-
ing the total load on the output amplifier of the active
device. The MAX4313/MAX4314/MAX4315 have a fixed
gain of +2V/V that is internally set with two 500
Ω thin-
film resistors. The impedance of the internal feedback
resistors must be taken into account when operating
multiple MAX4313/MAX4314/MAX4315s in large multi-
plexer applications.
For normal operation, drive SHDN high. If the shutdown
function is not used, connect SHDN to VCC.
Layout and Power-Supply Bypassing
The MAX4310–MAX4315 have very high bandwidths
and consequently require careful board layout, includ-
ing the possible use of constant-impedance microstrip
or stripline techniques.
To realize the full AC performance of these high-speed
amplifiers, pay careful attention to power-supply
bypassing and board layout. The PC board should
have at least two layers: a signal and power layer on
one side, and a large, low-impedance ground plane on
the other side. The ground plane should be as free of
voids as possible, with one exception: the feedback
(FB) should have as low a capacitance to ground as
possible. Therefore, layers that do not incorporate a
signal or power trace should not have a ground plane.
Whether or not a constant-impedance board is used, it
is best to observe the following guidelines when
designing the board:
1) Do not use wire-wrapped boards (they are too
inductive) or breadboards (they are too capacitive).
2) Do not use IC sockets; they increase parasitic
capacitance and inductance.
3) Keep signal lines as short and straight as possible.
Do not make 90° turns; round all corners.
4) Observe high-frequency bypassing techniques to
maintain the amplifier’s accuracy and stability.
5) Use surface-mount components. They generally
have shorter bodies and lower parasitic reactance,
yielding better high-frequency performance than
through-hole components.
OUT
IN-
SHDN, A0, A1, A2
IN+
10k
LOGIC INPUT
MAX431_
Figure 3. Circuit to Reduce Logic-Low Input Current
0
-10
0
50 100 150
300 350
500
-7
-8
-1
LOGIC-LOW THRESHOLD (mV ABOVE VEE)
200 250
400 450
-3
-5
-9
-2
-4
-6
Figure 4. Logic-Low Input Current vs. VIL with 10kΩ Series
Resistor
20
-160
0
50 100 150
300 350
500
-100
-120
0
LOGIC-LOW THRESHOLD (mV ABOVE VEE)
200 250
400 450
-60
-140
-20
-40
-80
Figure 2. Logic-Low Input Current vs. VIL (SHDN, A0, A1, A2)



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