BLF178P

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© NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 2 — 16 February 2012

9 of 13

NXP Semiconductors

BLF178P

Power LDMOS transistor

8.

Package outline

Fig 11. Package outline SOT539A

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOT539A

10-02-02

00-03-03

0

5

10 mm

scale

p

A

F

b

e

D

U2

L

H

Q

c

5

12

4

3

D1

E

A

w1

AB

M

M

M

q

U1

H1

C

B

M

M

w2

C

E1

M

w3

UNIT

A

mm

D

b

11.81

11.56

0.18

0.10

31.55

30.94

13.72

9.53

9.27

17.12

16.10

10.29

10.03

4.7

4.2

c

e

U2

0.25

0.25

0.51

w3

35.56

qw2

w1

F

1.75

1.50

U1

41.28

41.02

H1

25.53

25.27

p

3.30

3.05

Q

2.26

2.01

EE1

9.50

9.30

inches

0.465

0.455

0.007

0.004

1.242

1.218

D1

31.52

30.96

1.241

1.219

0.540

0.375

0.365

0.674

0.634

0.405

0.395

0.185

0.165

0.010

0.010 0.020

1.400

0.069

0.059

1.625

1.615

1.005

0.995

0.130

0.120

0.089

0.079

0.374

0.366

H

3.48

2.97

0.137

0.117

L

DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)

Flanged balanced LDMOST ceramic package; 2 mounting holes; 4 leads

SOT539A

Note

1. millimeter dimensions are derived from the original inch dimensions.

2. recommended screw pitch dimension of 1.52 inch (38.6 mm) based on M3 screw.