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Material Content Data Sheet

Sales Product Name

TDA5220

Issued

7. September 2015

MA#

MA000226486

Package

PG-TSSOP-28-1

Weight*

107.00 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

inorganic material

silicon

7440-21-3

2.457

2.30

2.30

22966

22966

leadframe

non noble metal

nickel

7440-02-0

14.398

13.46

134561

non noble metal

iron

7439-89-6

19.882

18.58

32.04

185822

320383

wire

noble metal

gold

7440-57-5

0.938

0.88

0.88

8768

8768

encapsulation

organic material

carbon black

1333-86-4

0.196

0.18

1833

plastics

epoxy resin

-

8.301

7.76

77585

inorganic material

silicondioxide

60676-86-0

56.867

53.15

61.09

531486

610904

leadfinish

non noble metal

tin

7440-31-5

1.559

1.46

1.46

14568

14568

plating

noble metal

silver

7440-22-4

1.416

1.32

1.32

13231

13231

glue

plastics

acrylic resin

-

0.196

0.18

1836

noble metal

silver

7440-22-4

0.786

0.73

0.91

7344

9180

*deviation

< 10%

Sum in total:

100.00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com