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PIC16CE623-04/P Datasheet(PDF) 95 Page - Microchip Technology

Part # PIC16CE623-04/P
Description  OTP 8-Bit CMOS MCU with EEPROM Data Memory
PDF  108 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

PIC16CE623-04/P Datasheet(HTML) 95 Page - Microchip Technology

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© 1998 Microchip Technology Inc.
Preliminary
DS40182A-page 95
PIC16CE62X
Package Type:
K04-072 20-Lead Plastic Shrink Small Outine (SS) – 5.30 mm
MIN
p
Pitch
Mold Draft Angle Bottom
Mold Draft Angle Top
Lower Lead Width
Radius Centerline
Gull Wing Radius
Shoulder Radius
Outside Dimension
Molded Package Width
Molded Package Length
Shoulder Height
Overall Pack. Height
Lead Thickness
Foot Angle
Foot Length
Standoff
Number of Pins
β
α
c
φ
A2
A1
A
n
E1
B†
L1
R2
L
R1
E‡
D‡
Dimension Limits
Units
0.65
0.026
8
0
0
5
5
10
10
0.012
0.007
0.005
0.020
0.005
0.005
0.306
0.208
0.283
0.005
0.036
0.073
20
0.301
0
0.010
0.005
0.000
0.015
0.005
0.005
0.205
0.278
0.002
0.026
0.068
0.311
0.015
0.009
0.010
0.025
0.010
0.010
4
8
0.212
0.289
0.008
0.046
0.078
0
0
5
5
10
10
7.65
0.25
0.13
0.00
0.38
0.13
0.13
0
5.20
7.07
0.05
0.66
1.73
7.90
7.78
4
0.32
0.18
0.13
0.13
0.51
0.13
0.38
0.22
0.25
0.25
0.64
0.25
5.29
7.20
0.13
20
1.86
0.91
5.38
7.33
0.21
1.99
1.17
NOM
INCHES
MAX
NOM
MILLIMETERS*
MIN
MAX
n
1
2
R1
R2
D
p
B
E1
E
L1
L
c
β
φ
α
A1
A
A2
* Controlling Parameter.
† Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡ Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
62X.bk Page 95 Tuesday, March 10, 1998 3:40 PM



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