LM3280TLSLASHNOPB datasheet(3/27 Pages) TI

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LM3280

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SNOSAU4B – OCTOBER 2006 – REVISED FEBRUARY 2013

Absolute Maximum Ratings

(1) (2)

SVIN, PVIN to SGND

−0.2V to +6.0V

PGND to SGND

−0.2V to +0.2V

ENs, FB, BYP, VCON

(SGND

−0.2V)

to (SVIN +0.2V)

w/6.0V max

SW, BYPOUT

(PGND

−0.2V)

to (PVIN +0.2V)

w/6.0V max

PVIN to SVIN

−0.2V to +0.2V

Continuous Power Dissipation

(3)

Internally Limited

Junction Temperature (TJ-MAX)

+150°C

Storage Temperature Range

−65°C to +150°C

Maximum Lead Temperature

(Soldering, 10 sec.)

+260°C

ESD Rating (4)

Human Body Model

2k V

Machine Model

200 V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed

performance limits and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and

disengages at TJ = 125°C (typ.).

(4)

The Human body model is a 100pF capacitor discharged through a 1.5k

Ω resistor into each pin. (MIL-STD-883 3015.7) The machine

model is a 200pF capacitor discharged directly into each pin. National Semiconductor recommends that all integrated circuits be

handled with appropriate precautions. Failure to observe proper ESD handling techniques can result in damage.

Operating Ratings

(1) (2)

Input Voltage Range

2.7V to 5.5V

Recommended Load Current

PWM Mode:

0mA to 300mA

Bypass Mode:

0mA to 500mA

LDO:

0mA to 20mA

Junction Temperature (TJ) Range

−30°C to +125°C

Ambient Temperature (TA) Range

−30°C to +85°C

(3)

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed

performance limits and associated test conditions, see the Electrical Characteristics tables.

(2)

Shutdown current includes leakage current of PFET and Bypass FET.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be de-rated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

Thermal Properties

Junction-to-Ambient Thermal Resistance (

θJA), DSBGA Package

(1)

48 °C/W

(1)

Junction-to-ambient thermal resistance (

θJA) is taken from thermal measurements, performed under the conditions and guidelines set

forth in the JEDEC standard JESD51-7. A 1" x 1", 4 layer, 1.5oz. Cu board was used for the measurements. The

θJA, which is

performed under the 4 layer cellphone board condition, is 86°C/W.

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