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SHT3X Datasheet(PDF) 9 Page - List of Unclassifed Manufacturers

Part # SHT3X
Description  Wide supply voltage range, from 2.4 to 5.5 V
PDF  13 Pages
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Manufacturer  ETC2 [List of Unclassifed Manufacturers]
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SHT3X Datasheet(HTML) 9 Page - List of Unclassifed Manufacturers

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Datasheet SHT3x-ARP
www.sensirion.com
May 2015 - Version 0.93
9/13
5.2
Package Outline
Figure 11 Dimensional drawing of SHT3x-ARP sensor package
Parameter
Symbol
Min
Nom. Max Units Comments
Package height
A
0.8
0.9
1
mm
Leadframe height
A3
0.2
mm
Not shown in the drawing
Pad width
b
0.2
0.25
0.3
mm
Package width
D
2.4
2.5
2.6
mm
Center pad length
D2
1
1.1
1.2
mm
Package length
E
2.4
2.5
2.6
mm
Center pad width
E2
1.7
1.8
1.9
mm
Pad pitch
e
0.5
mm
Pad length
L
0.3
0.35
0.4
mm
Max cavity
S
1.5
mm Only as guidance. This value includes all tolerances,
including displacement tolerances. Typically the
opening will be smaller.
Center pad marking
T1xT2
0.3x45°
mm
indicates the position of pin 1
Table 7 Package outline
5.3
Land Pattern
Figure 12 shows the land pattern. The land pattern is
understood to be the metal layer on the PCB, onto which
the DFN pads are soldered.
The solder mask is understood to be the insulating layer
on top of the PCB covering the copper traces. It is
recommended to design the solder mask as a Non-
Solder Mask Defined (NSMD) type. For NSMD pads, the
solder mask opening should provide a 60 μm to 75 μm
design clearance between any copper pad and solder
mask. As the pad pitch is only 0.5 mm we recommend to
have one solder mask opening for all 4 I/O pads on one
side.
For solder paste printing it is recommended to use a
laser-cut, stainless steel stencil with electro-polished
trapezoidal walls and with 0.1 or 0.125 mm stencil
thickness. The length of the stencil apertures for the I/O
pads should be the same as the PCB pads. However,
the position of the stencil apertures should have an offset
of 0.1 mm away from the center of the package. The die
pad aperture should cover about 70 – 90 % of the die
pad area –thus it should have a size of about 0.9 mm x
1.6 mm.
For information on the soldering process and further
recommendation on the assembly process please
consult
the
Application
Note
HT_AN_SHTxx_Assembly_of_SMD_Packages , which
can be found on the Sensirion webpage.
D
S
A
D2
L
T1 x T2



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