applications that require a minimum

amount of pressure on components.

low-modulus, filled-silicone polymer on a

rubber-coated fiberglass carrier.The

material can be used as an interface

where one side is in contact with a

leaded device.

Note: To build a part number, visit our

website at www.bergquistcompany.com.

TYPICAL APPLICATIONS INCLUDE

• Telecommunications

• Computer and peripherals

• Power conversion

• Between heat-generating semiconductors or

magnetic components and a heat sink

• Area where heat needs to be transferred to a frame,

chassis, or other type of heat spreader

CONFIGURATIONS AVAILABLE

• Sheet form and die-cut parts

PDS_GP_VOS_0711

FEATURES AND BENEFITS

• Thermal conductivity: 0.8 W/m-K

• Conformable, low hardness

• Enhanced puncture, shear and

tear resistance

• Electrically isolating

PRODUCT DESCRIPTION

Highly Conformable,Thermally Conductive

Material for Filling Air Gaps

July 2011

PROPERTY

IMPERIAL VALUE

METRIC VALUE

TEST METHOD

Color

Mauve/Pink

Mauve/Pink

Visual

Reinforcement Carrier

Sil-Pad

Sil-Pad

—

Thickness (inch) / (mm)

0.020 to 0.200

0.508 to 5.080

ASTM D374

Inherent Surface Tack (1 side)

1

1

—

Density (Bulk Rubber) (g/cc)

1.6

1.6

ASTM D792

Heat Capacity (J/g-K)

1.0

1.0

ASTM E1269

Hardness (BulkRubber) (Shore 00) (1)

25

25

ASTM D2240

Young's Modulus (psi) / (kPa) (2)

40

275

ASTM D575

Continuous Use Temp (°F) / (°C)

-76 to 392

-60 to 200

—

ELECTRICAL

Dielectric Breakdown Voltage (Vac)

>6000

>6000

ASTM D149

Dielectric Constant (1000 Hz)

5.5

5.5

ASTM D150

Volume Resistivity (Ohm-meter)

ASTM D257

Flame Rating

V-O

V-O

U.L. 94

THERMAL

Thermal Conductivity (W/m-K)

0.8

0.8

ASTM D5470

THERMAL PERFORMANCE vs. STRAIN

Deflection (% strain)

10

20

30

2.48

2.29

2.11

1) Thirty second delay value Shore 00 hardness scale. 2)Young’s Modulus, calculated using 0.01 in/min.step rate of strain

mal resistance. These values are provided for reference only. Actual application performance is directly related to the

surface roughness, flatness and pressure applied.

TYPICAL PROPERTIES OF GAP PAD VO SOFT

1

2

3

4

8

7

6

5

9

10

200

180

160

140

120

100

80

60

40

20

Thickness vs. Thermal Resistance

Gap Pad VO Soft