2

256Mb: x4, x8, x16 DDR333 SDRAM

Micron Technology, Inc., reserves the right to change products or specifications without notice.

256Mx4x8x16DDR333_B.p65 – Rev. B; Pub. 10/01

©2001, Micron Technology, Inc.

256Mb: x4, x8, x16

DDR333 SDRAM Addendum

PRELIMINARY

FBGA PACKAGE PINOUT

Q

DQ14

DQ12

DQ10

DQ8

DQ15

CK

A12

A11

A8

A6

A4

DQ13

DQ11

DQ9

UDQS

UDM

CK#

CKE

A9

A7

A5

DQ2

DQ4

DQ6

LDQS

LDM

WE#

RAS#

BA1

A0

A2

DQ0

CAS#

CS#

BA0

A10

A1

A3

DQ1

DQ3

DQ5

DQ7

A13

x16 (Top View)

Q

NC

NC

NC

NC

NC

CK

A12

A11

A8

A6

A4

DQ3

NC

DQ2

DQS

DM

CK#

CKE

A9

A7

A5

DQ0

NC

DQ1

NC

NC

WE#

RAS#

BA1

A0

A2

NC

CAS#

CS#

BA0

A10

A1

A3

NC

NC

NC

NC

A13

x4 (Top View)

Q

NC

NC

NC

NC

DQ7

CK

A12

A11

A8

A6

A4

DQ6

DQ5

DQ4

DQS

DM

CK#

CKE

A9

A7

A5

DQ1

DQ2

DQ3

NC

NC

WE#

RAS#

BA1

A0

A2

DQ0

CAS#

CS#

BA0

A10

A1

A3

NC

NC

NC

NC

A13

x8 (Top View)

12

3

4

5

6

7

8

9

A

B

C

D

E

F

G

H

J

K

L

M

A

B

C

D

E

F

G

H

J

K

L

M

12

3

4

5

6

7

8

9

A

B

C

D

E

F

G

H

J

K

L

M

A

B

C

D

E

F

G

H

J

K

L

M

12

3

4

5

6

7

8

9

L

A

B

C

D

E

F

G

H

J

K

M

L

A

B

C

D

E

F

G

H

J

K

M

FBGA PACKAGE MARKING

FBGA 60-BALL PACKAGE DIMENSION

Due to the physical size of the FBGA package, the full

ordering part number is not printed on the package.

Instead the following package code is utilized.

Top mark contains five fields

12345

• Field 1 (Product Family)

DRAM

D

DRAM - ES

Z

• Field 2 (Product Type)

2.5 Volt, DDR SDRAM, 60-ball

L

• Field 3 (Width)

x4 devices

B

x8 devices

C

x16 devices

D

• Field 4 (Density / Size)

256Mb

H

• Filed 5 (Speed Grade)

-6

J

-75Z

P

-75

F

-8

C

Example top mark for a MT46V32M4FJ-6: DLBFJ

1.20 MAX

MOLD COMPOUND: EPOXY NOVOLAC

SUBSTRATE: PLASTIC LAMINATE

SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or

62% Sn, 36% Pb, 2%Ag

SOLDER BALL PAD: Ø .33mm

0.850 ±0.075

16.00 ±0.10

8.00 ±0.05

SEATING PLANE

C

0.10 C

BALL A1

BALL A9

PIN A1 ID

61X

∅0.45

SOLDER BALL DIAMETER

REFERS TO POST REFLOW

CONDITION. THE PRE-

REFLOW DIAMETER IS Ø 0.40

5.50 ±0.05

11.00

1.00

TYP

0.80 TYP

1.80

CTR

9 .00 ±0.10

3.20 ±0.05

4.50 ±0.05

6.40

CL

CL

Bottom View