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MXP22-C Datasheet(PDF) 1 Page - Microsemi Corporation

Part # MXP22-C
Description  Monolithic Photodiode Array-Chip
PDF  1 Pages
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Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

MXP22-C Datasheet(HTML) 1 Page - Microsemi Corporation

  MXP22-C Datasheet HTML 1Page - Microsemi Corporation  
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Products
2830 S. Fairview St.
Santa Ana, CA 92704
PH: 714.979.8220
FAX: 714.557.5989
Data Sheet # MSC1338.PDF
Updated:June 1999
MXP22-C
Electrical Characteristic
s@ 25
oC
Features
•
Dielectrically Isolated Diodes
•
Aluminum Wire bondable
•
Backside Metallization - Gold
•
Die Attach methods: Eutectic or Epoxy
Monolithic Photodiode Array - Chip
SYMBOL
CHARACTERISTIC
CONDITIONS
MIN
TYP
MAX
UNITS
VOC
Open Circuit Voltage
10 mW/cm2, wavelength = 850 nm
10
Volts
ISC
Short Circuit Current
10 mW/cm2, wavelength = 850 nm
3.5
uA
VB
Reverse Breakdown Voltage
IR = 10 uA
20
Volts


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