SG55451BLSLASH883B datasheet(2/3 Pages) MICROSEMI

2 / 3 page

SG55451B/61/71 SERIES

5/92 Rev 1.1 2/94

LINFINITY Microelectronics Inc.

11861 Western Avenue

∞

∞ Garden Grove, CA 92841

(714) 898-8121

∞

∞ FAX: (714) 893-2570

Supply Voltage (V

CC) ............................................................

Input Voltage .....................................................................

Interemitter Voltage ...........................................................

Off-state Output Voltage

X5451B Series ................................................................

X5461 Series ..................................................................

X5471 Series ..................................................................

5.5V

30V

35V

70V

ABSOLUTE MAXIMUM RATINGS (Note 1)

Output Current .............................................................

Continuous Total Dissipation at (or below)

25°C Free-Air Temperature .....................................

Operating Junction Temperature

Hermetic (Y, L Packages) ..........................................

Storage Temperature Range ..........................

Lead Temperature (1/16 inch from case

for soldering 60 sec.) .................................................

400mA

800mW

150

°C

-65

°C to 150°C

300

°C

Note 1. Exceeding these ratings could cause damage to the device.

Y Package:

Thermal Resistance-Junction to Case,

JC ..................

50°C/W

Thermal Resistance-Junction to Ambient,

JA ............ 130°C/W

L Package:

Thermal Resistance-Junction to Case,

JC ..................

35°C/W

Thermal Resistance-Junction to Ambient,

JA ............ 120°C/W

THERMAL DATA

Note A. Junction Temperature Calculation: T

J = TA + (PD x θJA).

Note B. The above numbers for

JC are maximums for the limiting

thermal resistance of the package in a standard mount-

ing configuration. The

JA numbers are meant to be

guidelines for the thermal performance of the device/pc-

board system. All of the above assume no ambient

airflow.

Min. Typ. Max. Min. Typ. Max.

SG55451B

SG55461

SG55471

SG75451B

SG75461

SG75471

Test Conditions

Parameter

Units

-1.2

0.25

0.5

-1.0

0.8

-1.5

300

0.5

0.8

1.0

-1.6

-1.2

0.25

0.5

-1.0

High-level Input Voltage (V

IH)

Low-level Input Voltage (V

IL)

Input Clamp Voltage (V

IK)

High-level Output Current (I

OH)

Low-level Output Voltage (V

OL)

Input Current at Max V

IN)

High-level Input Current (I

IH )

Low-level Input Current (I

IL)

Supply Current, Outputs High

Supply Current, Outputs Low

µA

0.8

-1.5

100

0.4

0.7

1.0

-1.6

CC =

MIN, I

IN = -12mA

CC = MIN, VIH = 2V,

OH = 30V

SGX5451B

OH = 35V

SGX5461

OH = 70V

SGX5471

CC = MIN, VIL = 0.8V, IOL = 100mA

CC = MIN, VIL = 0.8V, IOL = 300mA

CC = MAX, VIN = 5.5V

CC = MAX, VIN = 2.4V

CC = MAX, VIN = 0.4V

CC = MAX, VIN = 5V

CC = MAX, VIN = 0V

SGX5451B

SGX5461

SGX5471

4.5V to 5.5V

4.75V to 5.25V

Supply Voltage (V

CC)

SG55451B, SG55461, SG55471 .......................

SG75451B, SG75461, SG75471 ...................

Operating Ambient Temperature Range

SG55451B, SG55461, SG55471 ...................

SG75451B, SG75461, SG75471 ........................

-55

°C to 125°C

°C to 70°C

Note 2. Range over which device is functional.

Note 3. The substrate (pin 8) must always be at the most-negative device voltage for proper operation.

RECOMMENDED OPERATING CONDITIONS (Notes 2 & 3)

ELECTRICAL CHARACTERISTICS

(Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG55451B/461/471 with -55

°C ≤ T

A ≤ 125 °C, and

SG75451B/461/471 with 0

°C ≤ T

A ≤ 70 °C.

Typical values are tested at V

CC = 5V, and T A = 25°C.

Low duty cycle pulse testing techniques are used

which maintains junction and case temperatures equal to the ambient temperature.)

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