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Electromigration Fail Mode

Wirebond Failure Mode

INA128-HT, INA129-HT

SBOS501F – JANUARY 2010 – REVISED FEBRUARY 2015

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(1)

See the data sheet for absolute maximum and minimum recommended operating conditions.

(2)

The predicted operating lifetime vs. junction temperature is based on reliability modeling using electromigration as the

dominant failure mechanism affecting device wearout for the specific device process and design characterisitics.

(3)

Wirebond lifetime is only applicable for D package.

Figure 1. INA128HD, INA129SKGD1, and INA129SKGD2 Operating Life Derating Chart

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