ISO7331FCQDWQ1 datasheet(13/30 Pages) TI

13 / 30 page

ISO7330-Q1, ISO7331-Q1

www.ti.com

SLLSER7 – NOVEMBER 2015

8.3 Feature Description

ORDERABLE DEVICE

CHANNEL DIRECTION

RATED ISOLATION

MAX DATA RATE

DEFAULT OUTPUT

ISO7330CQDWQ1 and

High

ISO7330CQDWRQ1

3 Forward,

0 Reverse

ISO7330FCQDWQ1 and

Low

ISO7330FCQDWRQ1

3000 VRMS / 4242 VPK

(1)

25 Mbps

ISO7331CQDWQ1 and

High

ISO7331CQDWRQ1

2 Forward,

1 Reverse

ISO7331FCQDWQ1 and

Low

ISO7331FCQDWRQ1

(1)

See the Regulatory Information section for detailed Isolation Ratings

8.3.1 High Voltage Feature Description

8.3.1.1 Package Insulation Specifications

over recommended operating conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

L(I01)

Minimum air gap (clearance)

Shortest terminal-to-terminal distance through air

Minimum external tracking

Shortest terminal-to-terminal distance across the

L(I02)

(creepage)

package surface

Tracking resistance (comparative

CTI

DIN EN 60112 (VDE 0303-11); IEC 60112

>400

tracking index)

Minimum internal gap (internal

DTI

Distance through the insulation

µm

clearance)

VIO = 500 V, TA = 25°C

>1012

Ω

Isolation resistance, input to

RIO

output(1)

VIO = 500 V, 100°C ≤ TA ≤ max

>1011

Ω

Isolation capacitance, input to

CIO

VIO = 0.4 sin (2πft), f = 1 MHz

output(1)

Input capacitance(2)

VI = VCC/2 + 0.4 sin (2πft), f = 1 MHz, VCC = 5 V

(1)

All pins on each side of the barrier tied together creating a two-terminal device.

(2)

Measured from input pin to ground.

NOTE

Creepage and clearance requirements should be applied according to the specific

equipment isolation standards of an application. Care should be taken to maintain the

creepage and clearance distance of a board design to ensure that the mounting pads of

the isolator on the printed-circuit board do not reduce this distance.

Creepage and clearance on a printed-circuit board become equal in certain cases.

Techniques such as inserting grooves and/or ribs on a printed circuit board are used to

help increase these specifications.

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